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(a) Critical dimensions (CDs) characterizing hourglass patterns. (b) RGB image of a wafer sample with hourglass patterns captured by a hyperspectral imaging system. (c) A 70-degree SEM picture from cross section of the area of the hourglass wafer sample specified with red rectangle in (b). (d) A right-angle SEM picture from cross section of the area specified with red rectangle in (b).